Semitron ESd 225
Semitron ESd 225 is designed for use where electrical discharge in operation is a problem. It is commonly used for sensitive electronic components including: integrated circuits, hard disk drives and circuit boards. It is also an excellent choice for material handling applications, and components in high speed electronic printing and reproducing equipment.
Semitron ESd 225 is dissipative and electrically stable. Static electricity is dissipated through this product as readily as it is dissipated along the surface. Semitron ESd 225 is ideal for fixturing used in the manufacturing of hard disk drives or for handling in-process silicon wafers. It is tan in color.
| Specification | Test | Value | Units |
| Specific Gravity, 73°F | D792 | 1.33 | Lb/in.3 |
| Tensile Strength @ Yield, 73°F | D638 | 5,400 | psi |
| Tensile Modulus of Elasticity, 73°F | D638 | 200,000 | psi |
| Tensile Elongation (at break), 73°F | D638 | 15 | % |
| Flexural Strength, 73°F | D790 | 7,300 | psi |
| Flexural Modulus of Elasticity | D790 | 220,000 | psi |
| Shear Strength, 73°F | D732 | - | psi |
| Compressive Strength – Ultimate | psi | ||
| Compressive Strength at 2% Deformation | psi | ||
| Compressive Strength at 10% Deformation | D695 | 8,000 | psi |
| Deformation Under Load | % | ||
| Compressive Modulus of Elasticity, 73°F | D695 | 175,000 | |
| Compressive Strength ⊥ to Laminate (Modulus) | psi | ||
| Compressive Strength ⊥ to Laminate (Yield) | psi | ||
| Compressive Strength ⊥ to Laminate (Ultimate) | psi | ||
| Hardness, Durometer (Shore “D” scale) | D2240 | - | |
| Hardness, Rockwell (Scale as noted) | D785 | M50 (R108) | Rockwell M |
| Izod Impact, Notched @ 73°F | D256 Type “A” | 1.5 | ft.lbs/in. of notch |
| Coefficient of Friction (Dry vs Steel) Static | |||
| Coefficient of Friction (Dry vs Steel) Dynamic | PTM55007 | 0.29 | |
| Maximum Static Bearing Load (P) | 1,000 | psi | |
| Maximum Unlubricated No Load Bearing Velocity (V) | 50 | ft/minute | |
| Maximum Limiting PV (Unlubricated) | PTM55007 | 2,000 | psi x ft/min. |
| Wear Factor “K” x 10-10 | PTM55010 | 30 | Cubic in.-min/ft.lbs.hr |
| Sand Wheel Wear/Abrasion Test | 50 | UHMW=100 | |
| Minimum Mating Surface Hardness | Rockwell (Brinnell) | ||
| Coefficient of Linear Thermal Expansion | E-831 (TMA) | 9.30 | in/in/°F x 10-5 |
| Coefficient of Thermal Expansion // to Laminates | 9.30 | in/in/°F x 10-5 | |
| Coefficient of Thermal Expansion I to Laminates | 9.30 | in/in/°F x 10-5 | |
| Softening Point | °F | ||
| Heat Deflection Temperature 264 psi | D648 | 225 | °F |
| Embrittlement Temperature | °F Min. | ||
| Continuous Service Temperature in Air | 180 | °F Max. | |
| Short Term Service Temperature | 200 | °F Max. | |
| Tg-Glass Transition (Amorphous) | D3418 | N/A | °F |
| Melting Point (Crystalline) Peak | D3418 | 320 | °F |
| Thermal Conductivity | F433 | - | BTU-in/(hr/ftF) |
| Dielectric Strength Short Term | D149 | - | Volts/mil |
| Volume Resistivity | D257 | 109 -101° | ohm/cm |
| Surface Resistivity | ohm/cm | ||
| Dielectric Constant, 106 Hz | D150 | - | |
| Dissipation Factor, 106 Hz | D150 | - | |
| Flammability @ 3.1mm(1/8 in.) UL94 | UL 94 | HB | |
| Arc Resistance | seconds | ||
| Water Absorption, Immersion 24 Hours | D570 (2) | 2.0 | % |
| Water Absorption, Immersion Saturation | D570 (2) | 8.0 | % |
| Machinability Rating | 1 | 1=easy, 10=difficult | |
| Rod Diameter Availability (Off the Shelf) | .250-6.0 | inches | |
| Sheet Thickness Availability (Off the Shelf) | .250-2.0 | inches |
| Characteristics / Attributes | Static Dissapative / Easily Machined / Wear Resistant |
